Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tetsuya Ohsawa0
Naohiro Terada0
Date of Patent
April 12, 2011
0Patent Application Number
120075600
Date Filed
January 11, 2008
0Patent Primary Examiner
Patent abstract
A stepped-part 4b with a lower tip side is formed on the top face of a pattern end 4, and a lower face 4c thereof is used as a plane on which a solder ball 7 is provided. One or more protrusions 4d made of a swollen conductive layer are formed on the lower face to limit displacement of the solder ball in the tip direction and the both side directions. The solder ball is held by the protrusions to suppress deviation of the solder ball.
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