US Patent 7816773 Package structure and manufacturing method thereof

A package structure and a manufacturing method thereof are provided. The package structure includes a leadframe, a die, a solder layer and several connecting components. The leadframe includes a heat dissipation pad and several leads. The heat dissipation pad is disposed in a substantial center of the leadframe. The leads are surrounding the heat dissipation pad. The die having an active surface is disposed on the leadframe. The solder layer is disposed between the active surface and the heat dissipation pad. The connecting components are disposed between the active surface and the leads. The die is electrically connected to the leadframe through the solder layer and the connecting components.