US Patent 7772019 Method for packaging LED device

A method for packaging LED device comprises following steps: (1) A substrate with a cavity is provided; (2) A electrode layer is formed and located on the cavity and the surface of the substrate; (3) A opening through the cavity is formed, whereby a anode and a cathode are separated by the opening; (4) A LED chip is disposed on the bottom of the cavity and the opening, where the led chip is electrically connected to the anode and the cathode; (5) The cavity with the opening is filled with packaging material; (6) The packaging material is hardened, thereby the hardened packaging material with a recess that corresponding to the top of the chip; and (7) The LED device is formed by performing a cutting process along a cutting line in the cavity.