Proposed is a power semiconductor module with a housing and one or a plurality of half-bridge circuitries arranged therein. Each half-bridge circuitry has a first (TOP) and a second (BOT) power switch and each switch is comprised of one power transistor and a corresponding power diode (recovery diode). The power semiconductor module furthermore has a positive polarity direct current lead and a negative polarity direct current lead. Per each half-bridge circuitry it furthermore has two alternate current leads that are not directly connected electrically. Each TOP transistor is connected to the power diode of the BOT switch and a first alternate current lead and each BOT transistor is connected to the power diode of the TOP switch and a second alternate current lead.