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US Patent 7728421 Semiconductor device

Patent 7728421 was granted and assigned to Renesas Technology Corp on June, 2010 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
77284211
Patent Inventor Names
Tetsuharu Tanoue1
Date of Patent
June 1, 2010
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Patent Application Number
116264641
Date Filed
January 24, 2007
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Patent Primary Examiner
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Sue Purvis
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Patent abstract

Plural via portions formed on a package substrate of a BGA include a first through-hole portion extended in the plane direction by an extension wiring connected to a land portion and a second through-hole portion that is arranged on the land portion serving as pad-on-via, whereby high-density wiring and multi-function of the BGA can be realized by using the package substrate having a two-layer wiring structure. Accordingly, cost for the package substrate can be reduced, and hence, cost for the BGA can be reduced, compared to a multi-layer wiring structure having four or six wiring layers.

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