Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Daisuke Ito1
Date of Patent
April 27, 2010
1Patent Application Number
123358611
Date Filed
December 16, 2008
1Patent Citations Received
Patent Primary Examiner
Patent abstract
After a semiconductor element is formed and before resin sealing is performed, a surface of a scribe line between the adjacent semiconductor elements of a semiconductor wafer is scraped thinly. A laser is irradiated on a broken layer of the surface of the scribe line thus scraped thinly to recrystallize the broken layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
