Log in
Enquire now
‌

US Patent 7641900 Wound treatment utilizing collagenase and a phosphotidylcholine organogel

OverviewStructured DataIssuesContributors

Contents

Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
76419001
Patent Inventor Names
Thomas Fallon1
Harry Soroff1
Marcia Simon1
Peter Fallon1
Gabriele Hatch1
Date of Patent
January 5, 2010
1
Patent Application Number
110935401
Date Filed
March 30, 2005
1
Patent Primary Examiner
‌
Ruth A Davis
1
Patent abstract

The effect of the action of collagenase in treating lesions containing collagen or mixed fibrin clots (e.g., burns or ulcers) is improved by applying collagenase to the wound in combination with an organogel and a phosphatidylcholine, of which lecithin is a readily available source, particularly when the collagenase is first mixed and stored with that choline and an organic solvent and is subsequently mixed with a second individually stored formulation comprising a gel-forming agent and water, the two formulations individually having satisfactory shelf lives and the resultant mixture being applied to the lesion promptly after being formed.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 7641900 Wound treatment utilizing collagenase and a phosphotidylcholine organogel

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.