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US Patent 7485926 SOI contact structures

Patent 7485926 was granted and assigned to X-Fab on February, 2009 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Patent attributes

Current Assignee

X-Fab

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

74859261

Patent Inventor Names

Wolfgang Goettlich1

Dirk Nuernbergk1

Steffen Richter1

Date of Patent

February 3, 2009

Patent Application Number

105438961

Date Filed

January 30, 2004

Patent Primary Examiner

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Laura M Menz

Patent abstract

Disclosed are an arrangement and a production method for electrically connecting active semiconductor structures in or on a monocrystalline silicon layer (12) located on the front face (V) of silicon-on-insulator semiconductor wafers (SOI, 10) to the substrate (13). The electrical connection (20) is made through an insulator layer (11). A stack of layers (30 to 32, 70 to 72) is disposed above the connection piece (20) on the insulator layer (11).