US Patent 7459344 Method for forming micromachined structure
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Patent Inventor Names
Chia-Hua Chang0
Hua-Shu Wu0
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Patent abstract
The invention provides a method of fabricating a micromachined structure, and in particular to a method of forming a micro-electro-mechanical system (MEMS) structure. A thin silicon cantilevered or suspended structure used to make micromachined structures is first formed from a SOI wafer or a bulk silicon wafer, followed by formation of the micromachined structures by semiconductor manufacturing techniques.
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US Patent 07459344 Method for forming micromachined structure US Patent 7459344 Method for forming micromachined structure
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Patent Number
074593440
Patent Number
74593440
Edits on 25 Apr, 2023
Golden AI
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Patent Jurisdiction
Patent Number
074593440
Date of Patent
December 2, 2008
0Patent Application Number
114636290
Date Filed
August 10, 2006
0Official Website
Patent Primary Examiner
Edits on 14 Jun, 2022
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US Patent 07459344 Method for forming micromachined structure
Infobox
Is a
Patent jurisdiction
Patent number
07459344
Date of patent
December 2, 2008
Patent application number
11463629
Date Filed
August 10, 2006
Patent primary examiner
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