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US Patent 7459344 Method for forming micromachined structure

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Patent
Patent
1

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
74593441
Patent Inventor Names
Hua-Shu Wu1
Chia-Hua Chang1
Date of Patent
December 2, 2008
1
Patent Application Number
114636291
Date Filed
August 10, 2006
1
Patent Primary Examiner
‌
Ha Tran T Nguyen
1
Patent abstract

The invention provides a method of fabricating a micromachined structure, and in particular to a method of forming a micro-electro-mechanical system (MEMS) structure. A thin silicon cantilevered or suspended structure used to make micromachined structures is first formed from a SOI wafer or a bulk silicon wafer, followed by formation of the micromachined structures by semiconductor manufacturing techniques.

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