US Patent 7403395 Power module structure and solid state relay using same
Patent 7403395 was granted and assigned to Omron on July, 2008 by the United States Patent and Trademark Office.
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A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.
US Patent 07403395 Power module structure and solid state relay using same US Patent 7403395 Power module structure and solid state relay using same
US Patent 07403395 Power module structure and solid state relay using same
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