US Patent 7335993 Multi chip package

A multi chip package includes a first semiconductor chip, a second semiconductor chip and a spacer. The spacer is formed between the first semiconductor chip and the second semiconductor chip. The second semiconductor chip is fixed on the first semiconductor chip by an adhesive material that is formed on the first semiconductor chip. Since the spacer is formed between the first semiconductor chip and the second semiconductor chip, the space between the first semiconductor chip and the second semiconductor chip is even.