Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 26, 2008
Patent Application Number
10639633
Date Filed
August 13, 2003
Patent Primary Examiner
Patent abstract
A multi chip package includes a first semiconductor chip, a second semiconductor chip and a spacer. The spacer is formed between the first semiconductor chip and the second semiconductor chip. The second semiconductor chip is fixed on the first semiconductor chip by an adhesive material that is formed on the first semiconductor chip. Since the spacer is formed between the first semiconductor chip and the second semiconductor chip, the space between the first semiconductor chip and the second semiconductor chip is even.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
