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Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kiyonori Watanabe1
Date of Patent
October 16, 2007
1Patent Application Number
109024671
Date Filed
July 30, 2004
1Patent Primary Examiner
Patent abstract
The present invention provides a semiconductor device capable of improving productivity while maintaining electrical characteristics, and a manufacturing method thereof. One characteristic point of the present invention is that a plating processing condition (A) for forming a metal wiring layer (redistribution wiring) corresponding to a first conductive layer and a plating processing condition (B) for forming a post electrode corresponding to a second conductive layer are made different from each other.
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