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US Patent 7220654 Method for manufacturing semiconductor substrate

Patent 7220654 was granted and assigned to Denso on May, 2007 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Denso
Denso
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7220654
Patent Inventor Names
Noriyuki Iwamori1
Hiroaki Himi1
Date of Patent
May 22, 2007
Patent Application Number
10716606
Date Filed
November 20, 2003
Patent Primary Examiner
‌
Thanhha S. Pham
Patent abstract

An epitaxial layer is formed on a high-resistance semiconductor substrate containing interstitial oxygen at a high concentration, and then a heat treatment is performed to the semiconductor substrate at a high temperature in an oxidizing atmosphere. Accordingly, a stratiform region of SiO2 is formed by deposition at an interface between the epitaxial layer and the semiconductor substrate. As a result, an apparent SOI substrate for an SOI semiconductor device can be manufactured at a low cost.

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