Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tsutomu Yasui1
Ryoichi Kondo1
Takaaki Domon1
Toshiyuki Nagatsuka1
Date of Patent
October 24, 2006
1Patent Application Number
110715741
Date Filed
March 4, 2005
1Patent Primary Examiner
Patent abstract
A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.
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