Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nobutoshi Saito0
Tsuyoshi Tokuoka0
Junichiro Yoshioka0
Date of Patent
October 10, 2006
0Patent Application Number
107797080
Date Filed
February 18, 2004
0Patent Primary Examiner
Patent abstract
The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.
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