US Patent 7071126 Densifying a relatively porous material
Patent 7071126 was granted and assigned to Intel on July, 2006 by the United States Patent and Trademark Office.
All edits
Edits on 14 Aug, 2024
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 24 Nov, 2023
Golden AI
Edits made to:
Infobox (+10 properties)
Article (+349 characters)
Article
Patent abstract
An interlayer dielectric may be exposed to a gas cluster ion beam to densify an upper layer of the interlayer dielectric. As a result, the upper layer of the interlayer dielectric may be densified without separate deposition steps and without the need for etch stops that may adversely affect the capacitance of the overall structure.
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kevin P. O'Brien0
Steven W. Johnston0
Date of Patent
July 4, 2006
0Patent Application Number
111016880
Date Filed
April 8, 2005
0Patent Primary Examiner
Golden AI
Edits made to:
US Patent 7071126 Densifying a relatively porous material
Find more entities like US Patent 7071126 Densifying a relatively porous material
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.