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US Patent 7071126 Densifying a relatively porous material

Patent 7071126 was granted and assigned to Intel on July, 2006 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Current Assignee
Intel
Intel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
70711260
Patent Inventor Names
Kevin P. O'Brien0
Steven W. Johnston0
Date of Patent
July 4, 2006
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Patent Application Number
111016880
Date Filed
April 8, 2005
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Patent Citations Received
‌
US Patent 12060639 Rapid flush purging during atomic layer deposition
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Patent Primary Examiner
‌
Fernando L Toledo
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Patent abstract

An interlayer dielectric may be exposed to a gas cluster ion beam to densify an upper layer of the interlayer dielectric. As a result, the upper layer of the interlayer dielectric may be densified without separate deposition steps and without the need for etch stops that may adversely affect the capacitance of the overall structure.

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