Log in
Enquire now
‌

US Patent 7071126 Densifying a relatively porous material

Patent 7071126 was granted and assigned to Intel on July, 2006 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Current Assignee
Intel
Intel
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
70711261
Patent Inventor Names
Kevin P. O'Brien1
Steven W. Johnston1
Date of Patent
July 4, 2006
1
Patent Application Number
111016881
Date Filed
April 8, 2005
1
Patent Citations Received
‌
US Patent 12060639 Rapid flush purging during atomic layer deposition
2
Patent Primary Examiner
‌
Fernando L Toledo
1
Patent abstract

An interlayer dielectric may be exposed to a gas cluster ion beam to densify an upper layer of the interlayer dielectric. As a result, the upper layer of the interlayer dielectric may be densified without separate deposition steps and without the need for etch stops that may adversely affect the capacitance of the overall structure.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 7071126 Densifying a relatively porous material

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.