US Patent 11917797 Integrated thermal-electrical component for power electronics converters

The disclosure relates to capacitive heatsink devices and systems. In one embodiment, the heat sink capacitor includes a positive (P) bus plate; a negative (N) bus plate; a first dielectric material; a second dielectric material; and a heat sink comprising a first side and a second side, the first side of the heat sink attached to the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are separated by a portion of the heat sink, wherein the first dielectric material electrically insulates the P bus plate from the first side of the heat sink to form a first capacitor, and wherein the second dielectric material electrically insulates the N bus plate from the first side of the heat sink to form a second capacitor.