Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mayank Kalra1
Ryan Cohn1
Julio L. Vergara1
Daniel M. Estrada1
Andrew Padula1
Date of Patent
February 20, 2024
1Patent Application Number
161371241
Date Filed
September 20, 2018
1Patent Citations
...
Patent Primary Examiner
Patent abstract
A heat exchange module alone or part of a system including a control console. The HEM can include a channel enclosure assembly, a thermoelectric cooler (TEC) assembly and a heat transfer (cover) assembly. The enclosure assembly includes a channel for a heat-transfer liquid. The module can be constructed to provide for flexibility to better conform and fit on rounded and/or angular body parts and to efficiently transfer heat between the adjacent body part and the heat-transfer liquid via the TECs of the TEC assembly.
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