US Patent 11651611 Device mountable packaging of ultrasonic transducers
Patent 11651611 was granted and assigned to Invensense, Inc. on May, 2023 by the United States Patent and Trademark Office.
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Patent Inventor Names
Julius Ming-Lin Tsai0
Edits on 17 May, 2023
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US Patent 11651611 Device mountable packaging of ultrasonic transducers
Article
A mobile device including a processor, a memory unit, a display device disposed on a first surface of the mobile device, and a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116516110
Date of Patent
May 16, 2023
0Patent Application Number
165911660
Date Filed
October 2, 2019
0Patent Citations
Patent Primary Examiner
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