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US Patent 11651611 Device mountable packaging of ultrasonic transducers

Patent 11651611 was granted and assigned to Invensense, Inc. on May, 2023 by the United States Patent and Trademark Office.

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Patent attributes

Patent Applicant

Invensense, Inc.

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Current Assignee

Invensense, Inc.

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Julius Ming-Lin Tsai1

Date of Patent

May 16, 2023

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Patent Application Number

165911661

Date Filed

October 2, 2019

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Patent Citations

US Patent 10275638 Methods of biometric imaging of input surfaces

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US Patent 8311514 Prevention of accidental device activation

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US Patent 10006824 Microelectromechanical systems (MEMS) pressure sensor having a leakage path to a cavity

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US Patent 10080544 Ultrasound 3D imaging system

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US Patent 10562070 Receive operation of an ultrasonic sensor

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US Patent 10600403 Transmit operation of an ultrasonic sensor

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US Patent 10643052 Image generation in an electronic device using ultrasonic transducers

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US Patent 10656255 Piezoelectric micromachined ultrasonic transducer (PMUT)

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Patent Primary Examiner

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CPC Code

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A mobile device including a processor, a memory unit, a display device disposed on a first surface of the mobile device, and a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.

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