Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Dino Sasaridis1
Colin Kenneth Campbell1
Alan David Tepe1
Robert James Ramm1
Wenjun Liu1
Date of Patent
October 18, 2022
1Patent Application Number
153340901
Date Filed
October 25, 2016
1Patent Primary Examiner
A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
