US Patent 11191152 Printed circuit board signal layer testing
Patent 11191152 was granted and assigned to Hewlett Packard Enterprise on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A printed circuit board (PCB) may include a signal layer having a functional region and a PCB signal layer testing region. The PCB signal layer testing region may include a first differential pair having a first length formed on the signal layer, a second differential pair having a second length, different than the first length, formed on the signal layer and a third differential pair having a third length, different than the first length and different than the second length, formed on the signal layer.
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Patent Inventor Names
Christian Olsen0
Elene Chobanyan0
Karl J. Bois0
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Official Website
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111911520
Date of Patent
November 30, 2021
0Patent Application Number
162520160
Date Filed
January 18, 2019
0Official Website
Patent Primary Examiner
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US Patent 11191152 Printed circuit board signal layer testing
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11191152
Date of patent
November 30, 2021
Patent application number
16252016
Date Filed
January 18, 2019
Patent primary examiner
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