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US Patent 11191152 Printed circuit board signal layer testing

Patent 11191152 was granted and assigned to Hewlett Packard Enterprise on November, 2021 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
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Patent
Patent
1

Patent attributes

Patent Applicant
Hewlett Packard Enterprise
Hewlett Packard Enterprise
1
Current Assignee
Hewlett Packard Enterprise
Hewlett Packard Enterprise
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
111911521
Patent Inventor Names
Karl J. Bois1
Christian Olsen1
Elene Chobanyan1
Date of Patent
November 30, 2021
1
Patent Application Number
162520161
Date Filed
January 18, 2019
1
Patent Primary Examiner
‌
Jermele M Hollington
1
Patent abstract

A printed circuit board (PCB) may include a signal layer having a functional region and a PCB signal layer testing region. The PCB signal layer testing region may include a first differential pair having a first length formed on the signal layer, a second differential pair having a second length, different than the first length, formed on the signal layer and a third differential pair having a third length, different than the first length and different than the second length, formed on the signal layer.

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