Log in
Enquire now
‌

US Patent 11127649 Electronic apparatus

Patent 11127649 was granted and assigned to Toshiba Memory Corporation on September, 2021 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent

Patent attributes

Patent Applicant
Toshiba Memory Corporation
Toshiba Memory Corporation
Current Assignee
Toshiba Memory Corporation
Toshiba Memory Corporation
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11127649
Date of Patent
September 21, 2021
Patent Application Number
20190726
Date Filed
July 26, 2019
Patent Citations Received
‌
US Patent 11547018 Semiconductor storage device
Patent abstract

An electronic apparatus includes a first board, a second board, a housing, and a first thermal conductive assembly. The housing accommodates the first board and the second board. The first thermal conductive assembly connects a face of the first board, the face of the first board fronting a region between the first board and the second board, to a first face of the housing or a second face of the housing. The first face is opposed to the first board, the second face is opposed to the second board.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 11127649 Electronic apparatus

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.