Patent 11127649 was granted and assigned to Toshiba Memory Corporation on September, 2021 by the United States Patent and Trademark Office.
An electronic apparatus includes a first board, a second board, a housing, and a first thermal conductive assembly. The housing accommodates the first board and the second board. The first thermal conductive assembly connects a face of the first board, the face of the first board fronting a region between the first board and the second board, to a first face of the housing or a second face of the housing. The first face is opposed to the first board, the second face is opposed to the second board.