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US Patent 10888941 Power semiconductor module

Patent 10888941 was granted and assigned to Hitachi Power Semiconductor Device, Ltd. on January, 2021 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
Hitachi Power Semiconductor Device, Ltd.
Hitachi Power Semiconductor Device, Ltd.
1
Current Assignee
Hitachi Power Semiconductor Device, Ltd.
Hitachi Power Semiconductor Device, Ltd.
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
108889411
Patent Inventor Names
Toru Masuda1
Daichi Kawamura1
Junpei Kusukawa1
Naoki Sakurai1
Date of Patent
January 12, 2021
1
Patent Application Number
161688571
Date Filed
October 24, 2018
1
Patent Primary Examiner
‌
Omar F Mojaddedi
1
Patent abstract

When a distance between an end portion of a brazing material and a downward extended line of a side surface of an insulating substrate is taken as “a”, and a distance between an end portion of a solder resist on the side of a solder and the downward extended line of the side surface of the insulating substrate is taken as “b”, the positional relationship a<b is satisfied. The position of the end portion of the solder is regulated by the solder resist, and the position of the end portion of the brazing material on the side of the side surface of the insulating substrate is closer to the side of the side surface of the insulating substrate than to the position of the end portion of the solder on the side of the side surface of the insulating substrate.

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