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US Patent 10277974 Headphone

Patent 10277974 was granted and assigned to Sony on April, 2019 by the United States Patent and Trademark Office.

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Contents

Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
Sony
Sony
1
Current Assignee
Sony
Sony
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
102779741
Patent Inventor Names
Tomohiro Ito1
Nobuyuki Ishizaku1
Shunsuke Shiomi1
Yosuke Nakamura1
Date of Patent
April 30, 2019
1
Patent Application Number
148990211
Date Filed
May 1, 2014
1
Patent Citations Received
‌
US Patent 11985463 Headphones with increased back volume
2
‌
US Patent 11252492 Headphones with removable earpieces
‌
US Patent 11259107 Headphone earpads with textile layer having a low porosity region
‌
US Patent 11700471 Headphones with an anti-buckling assembly
5
‌
US Patent 11375306 Headphones with increased back volume
1
Patent Primary Examiner
‌
Matthew A Eason
1
Patent abstract

A headphone includes: a headband; a pair of housing support portions, one and the other of which are provided at one and the other ends of the headband, respectively; a pair of rotational shafts, one and the other of which rotatably connect one and the other of the pair of housing support portions to the headband, respectively; a pair of housings, one and the other of which are provided on one and the other of the pair of housing support portions, respectively, wherein, in a folded state of the housing support portions as a result of a rotation, the pair of housings are disposed in positions contained within an area inside an arc formed by the headband and the housing support portions in an opened state of the housing support portions, and are located side by side without crossing each other; and a pair of ear pads.

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