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US Patent 10157407 Financier-facilitated guaranty provisioning

Patent 10157407 was granted and assigned to Elwha on December, 2018 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Edward K. Y. Jung1

Richard T. Lord1

Robert W. Lord1

Date of Patent

December 18, 2018

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Patent Application Number

141676371

Date Filed

January 29, 2014

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Patent Citations Received

US Patent 11501367 System and method of an automated agent to automatically implement loan activities based on loan status

US Patent 12067630 Adaptive intelligence and shared infrastructure lending transaction enablement platform responsive to crowd sourced information

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US Patent 11481840 System and method of varied terms and conditions of a subsidized loan

US Patent 11488059 Transaction-enabled systems for providing provable access to a distributed ledger with a tokenized instruction set

US Patent 11494836 System and method that varies the terms and conditions of a subsidized loan

US Patent 11494694 Transaction-enabled systems and methods for creating an aggregate stack of intellectual property

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US Patent 11424944 Transaction-enabled systems for providing provable access to a distributed ledger with a tokenized instruction set

US Patent 11443372 Systems and methods for using social network data to validate a loan guarantee

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Patent Primary Examiner

1

Patent abstract

Disclosed herein are example embodiments for financier-facilitated guaranty provisioning. For certain example embodiments, at least one device, such as a server device of a financier: (i) may discover at least one authorization request corresponding to at least one product transaction; or (ii) may provide at least one proffered guaranty transaction to at least one guarantor. However, claimed subject matter is not limited to any particular described embodiments, implementations, examples, or so forth.

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