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US Patent 10144573 Thermally activatable insulating packaging

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Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10144573
Patent Inventor Names
Matthew R. Cook0
Thomas Z. Fu0
Date of Patent
December 4, 2018
Patent Application Number
15160035
Date Filed
May 20, 2016
Patent Citations Received
‌
US Patent 11773297 Dielectric heating of foamable compositions
‌
US Patent 11926134 Process for forming improved protective eco-friendly pouch and packaging and products made therefrom
0
‌
US Patent 11833788 Method for producing a multi-layer substrate
0
Patent Primary Examiner
‌
Christopher Demeree
Patent abstract

A method of making a container includes applying an insulating material in an inactive form to form a layer on a first substrate. The applied insulating material includes expandable microspheres. The method further includes joining a second substrate to the first substrate to adhere the first substrate to the second substrate and to create at least a portion of a multi-layer composite having at least one air gap between the first substrate and the second substrate. The method further includes heating the applied insulating material to activate expandable microspheres thereof to form expanded microspheres. The method further includes increasing the thickness of the applied insulating material layer to thereby increase the volume of the air gap between the first substrate and the second substrate of the multi-layer composite by the heating of the applied insulating material. The method further includes forming the multi-layer composite into a container having expanded microspheres.

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