Patent attributes
A food processing device (10) includes a drive assembly coupled to a dualaction cutting tool (20) and a single-action dicing tool (40). First and second cutting assemblies (51, 52) are disposed on the cutting tool (20) and are adapted to make first and second cuts in a food substrate as the cutting tool (20) rotates within a food processing path (26). The cutting tool (20) is further adapted to urge the cut food substrate towards and through the dicing tool (40) where generally parallel spaced-apart blades (66) further cut the food substrate to form diced food elements. The sequential cutting arrangement of the cutting tool (20) and the dicing tool (40) provides for a food processing device (10) that is capable of dicing a food substrate with lower torque and lower power requirements as compared to conventional dicing methods.
