H01L 2224/1411
Disposition relative to the bonding areas, e.g. bond pads, of the semiconductor or solid-state body the bump connectors being bonded to at least one common bonding area
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Edits on 16 Mar, 2022
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Edits on 5 Mar, 2022
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H01L 2224/1411
Disposition relative to the bonding areas, e.g. bond pads, of the semiconductor or solid-state body the bump connectors being bonded to at least one common bonding area
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