H01L 2224/13028

Disposition relative to the bonding area, e.g. bond pad, of the semiconductor or solid-state body the bump connector being disposed on at least two separate bonding areas, e.g. bond pads

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Edits on 16 Mar, 2022

"Entity importer update"

Golden AI

edited on 16 Mar, 2022

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Parent classification

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H01L 2224/13026

Edits on 5 Mar, 2022

"Created via: Entity Importer"

Golden AI

created this topic on 5 Mar, 2022

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Infobox (+3 properties)

Description (+186 characters)

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H01L 2224/13028

Disposition relative to the bonding area, e.g. bond pad, of the semiconductor or solid-state body the bump connector being disposed on at least two separate bonding areas, e.g. bond pads

Infobox

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Patent classification

Classification Type

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Cooperative Patent Classification

Website

http://data.epo.org/linked-data/def/cpc/H01L2224-13028

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