List of Vertical Circuits patents

List of Vertical Circuits patents

List of Coby Electronics Corporation patents

List of Veeva Systems patents

List of Cytek BioSciences, Inc. patents

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Vertical Circuits

	Name	Description	Patent Applicant	Current Assignee	Inventor	Patent Jurisdiction	Patent Number	Date of Patent
	‌ US Patent 7535109 Die assembly having electrical interconnect	Patent 7535109 was granted and assigned to Vertical Circuits on May, 2009 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	7535109	May 19, 2009
	‌ US Patent 7245021 Micropede stacked die component assembly	Patent 7245021 was granted and assigned to Vertical Circuits on July, 2007 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	7245021	July 17, 2007
	‌ US Patent 7923349 Wafer level surface passivation of stackable integrated circuit chips	Patent 7923349 was granted and assigned to Vertical Circuits on April, 2011 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	7923349	April 12, 2011
	‌ US Patent 7863159 Semiconductor die separation method	Patent 7863159 was granted and assigned to Vertical Circuits on January, 2011 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	7863159	January 4, 2011
	‌ US Patent 8159053 Flat leadless packages and stacked leadless package assemblies	Patent 8159053 was granted and assigned to Vertical Circuits on April, 2012 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	8159053	April 17, 2012
	‌ US Patent 7215018 Stacked die BGA or LGA component assembly	Patent 7215018 was granted and assigned to Vertical Circuits on May, 2007 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	7215018	May 8, 2007
	‌ US Patent 7843046 Flat leadless packages and stacked leadless package assemblies	Patent 7843046 was granted and assigned to Vertical Circuits on November, 2010 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	7843046	November 30, 2010
	‌ US Patent 7705432 Three dimensional six surface conformal die coating	Patent 7705432 was granted and assigned to Vertical Circuits on April, 2010 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	7705432	April 27, 2010
	‌ US Patent 8178978 Support mounted electrically interconnected die assembly	Patent 8178978 was granted and assigned to Vertical Circuits on May, 2012 by the United States Patent and Trademark Office.		Vertical Circuits		United States Patent and Trademark Office	8178978	May 15, 2012

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