List of Tru-Si Technologies patents

Patents where

Current Assignee

Name

Tru-Si Technologies

Name	Description	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 7049170 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities	Patent 7049170 was granted and assigned to Tru-Si Technologies on May, 2006 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7049170	May 23, 2006
‌ US Patent 6882030 Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate	Patent 6882030 was granted and assigned to Tru-Si Technologies on April, 2005 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	6882030	April 19, 2005
‌ US Patent 7034401 Packaging substrates for integrated circuits and soldering methods	Patent 7034401 was granted and assigned to Tru-Si Technologies on April, 2006 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7034401	April 25, 2006
‌ US Patent 7060601 Packaging substrates for integrated circuits and soldering methods	Patent 7060601 was granted and assigned to Tru-Si Technologies on June, 2006 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7060601	June 13, 2006
‌ US Patent 7186586 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities	Patent 7186586 was granted and assigned to Tru-Si Technologies on March, 2007 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7186586	March 6, 2007
‌ US Patent 7144056 Detection and handling of semiconductor wafers and wafers-like objects	Patent 7144056 was granted and assigned to Tru-Si Technologies on December, 2006 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7144056	December 5, 2006
‌ US Patent 7241641 Attachment of integrated circuit structures and other substrates to substrates with vias	Patent 7241641 was granted and assigned to Tru-Si Technologies on July, 2007 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7241641	July 10, 2007
‌ US Patent 7241675 Attachment of integrated circuit structures and other substrates to substrates with vias	Patent 7241675 was granted and assigned to Tru-Si Technologies on July, 2007 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7241675	July 10, 2007
‌ US Patent 7521360 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby	Patent 7521360 was granted and assigned to Tru-Si Technologies on April, 2009 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7521360	April 21, 2009
‌ US Patent 7173327 Clock distribution networks and conductive lines in semiconductor integrated circuits	Patent 7173327 was granted and assigned to Tru-Si Technologies on February, 2007 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7173327	February 6, 2007
‌ US Patent 7179397 Plasma processing methods and apparatus	Patent 7179397 was granted and assigned to Tru-Si Technologies on February, 2007 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7179397	February 20, 2007
‌ US Patent 7510928 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques	Patent 7510928 was granted and assigned to Tru-Si Technologies on March, 2009 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7510928	March 31, 2009
‌ US Patent 7104579 Detection and handling of semiconductor wafers and wafer-like objects	Patent 7104579 was granted and assigned to Tru-Si Technologies on September, 2006 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7104579	September 12, 2006
‌ US Patent 6897148 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby	Patent 6897148 was granted and assigned to Tru-Si Technologies on May, 2005 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	6897148	May 24, 2005
‌ US Patent 7052229 Alignment of semiconductor wafers and other articles	Patent 7052229 was granted and assigned to Tru-Si Technologies on May, 2006 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7052229	May 30, 2006
‌ US Patent 6958285 Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings	Patent 6958285 was granted and assigned to Tru-Si Technologies on October, 2005 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	6958285	October 25, 2005
‌ US Patent 7027894 Article holders with sensors detecting a type of article held by the holder	Patent 7027894 was granted and assigned to Tru-Si Technologies on April, 2006 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7027894	April 11, 2006
‌ US Patent 6948898 Alignment of semiconductor wafers and other articles	Patent 6948898 was granted and assigned to Tru-Si Technologies on September, 2005 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	6948898	September 27, 2005
‌ US Patent 6899788 Article holders that use gas vortices to hold an article in a desired position	Patent 6899788 was granted and assigned to Tru-Si Technologies on May, 2005 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	6899788	May 31, 2005
‌ US Patent 7001825 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same	Patent 7001825 was granted and assigned to Tru-Si Technologies on February, 2006 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	7001825	February 21, 2006
‌ US Patent 6935830 Alignment of semiconductor wafers and other articles	Patent 6935830 was granted and assigned to Tru-Si Technologies on August, 2005 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	6935830	August 30, 2005
‌ US Patent 6844241 Fabrication of semiconductor structures having multiple conductive layers in an opening	Patent 6844241 was granted and assigned to Tru-Si Technologies on January, 2005 by the United States Patent and Trademark Office.	Tru-Si Technologies	United States Patent and Trademark Office	6844241	January 18, 2005

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