Log in
Enquire now

List of Tru-Si Technologies patents

List of Tru-Si Technologies patents
List of Uptake Medical patents
List of Environmental Dynamics International patents
List of The Jackson Laboratory patents
Investors in BetterView
List of SBIR/STTR awards granted to Target Arm Inc.
Patents where
Current Assignee
Name
is
Tru-Si TechnologiesTru-Si Technologies
Name
Description
Patent Applicant
Current Assignee
Inventor
Patent Jurisdiction
Patent Number
Date of Patent
‌
US Patent 7049170 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Patent 7049170 was granted and assigned to Tru-Si Technologies on May, 2006 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7049170
May 23, 2006
‌
US Patent 6882030 Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate

Patent 6882030 was granted and assigned to Tru-Si Technologies on April, 2005 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
6882030
April 19, 2005
‌
US Patent 7060601 Packaging substrates for integrated circuits and soldering methods

Patent 7060601 was granted and assigned to Tru-Si Technologies on June, 2006 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7060601
June 13, 2006
‌
US Patent 7034401 Packaging substrates for integrated circuits and soldering methods

Patent 7034401 was granted and assigned to Tru-Si Technologies on April, 2006 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7034401
April 25, 2006
‌
US Patent 7186586 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Patent 7186586 was granted and assigned to Tru-Si Technologies on March, 2007 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7186586
March 6, 2007
‌
US Patent 7144056 Detection and handling of semiconductor wafers and wafers-like objects

Patent 7144056 was granted and assigned to Tru-Si Technologies on December, 2006 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7144056
December 5, 2006
‌
US Patent 7104579 Detection and handling of semiconductor wafers and wafer-like objects

Patent 7104579 was granted and assigned to Tru-Si Technologies on September, 2006 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7104579
September 12, 2006
‌
US Patent 7241675 Attachment of integrated circuit structures and other substrates to substrates with vias

Patent 7241675 was granted and assigned to Tru-Si Technologies on July, 2007 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7241675
July 10, 2007
‌
US Patent 7241641 Attachment of integrated circuit structures and other substrates to substrates with vias

Patent 7241641 was granted and assigned to Tru-Si Technologies on July, 2007 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7241641
July 10, 2007
‌
US Patent 7521360 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby

Patent 7521360 was granted and assigned to Tru-Si Technologies on April, 2009 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7521360
April 21, 2009
‌
US Patent 7179397 Plasma processing methods and apparatus

Patent 7179397 was granted and assigned to Tru-Si Technologies on February, 2007 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7179397
February 20, 2007
‌
US Patent 7510928 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques

Patent 7510928 was granted and assigned to Tru-Si Technologies on March, 2009 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7510928
March 31, 2009
‌
US Patent 7173327 Clock distribution networks and conductive lines in semiconductor integrated circuits

Patent 7173327 was granted and assigned to Tru-Si Technologies on February, 2007 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7173327
February 6, 2007
‌
US Patent 6948898 Alignment of semiconductor wafers and other articles

Patent 6948898 was granted and assigned to Tru-Si Technologies on September, 2005 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
6948898
September 27, 2005
‌
US Patent 6899788 Article holders that use gas vortices to hold an article in a desired position

Patent 6899788 was granted and assigned to Tru-Si Technologies on May, 2005 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
6899788
May 31, 2005
‌
US Patent 6844241 Fabrication of semiconductor structures having multiple conductive layers in an opening

Patent 6844241 was granted and assigned to Tru-Si Technologies on January, 2005 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
6844241
January 18, 2005
‌
US Patent 7001825 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same

Patent 7001825 was granted and assigned to Tru-Si Technologies on February, 2006 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7001825
February 21, 2006
‌
US Patent 6935830 Alignment of semiconductor wafers and other articles

Patent 6935830 was granted and assigned to Tru-Si Technologies on August, 2005 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
6935830
August 30, 2005
‌
US Patent 7052229 Alignment of semiconductor wafers and other articles

Patent 7052229 was granted and assigned to Tru-Si Technologies on May, 2006 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7052229
May 30, 2006
‌
US Patent 7027894 Article holders with sensors detecting a type of article held by the holder

Patent 7027894 was granted and assigned to Tru-Si Technologies on April, 2006 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
7027894
April 11, 2006
‌
US Patent 6897148 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby

Patent 6897148 was granted and assigned to Tru-Si Technologies on May, 2005 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
6897148
May 24, 2005
‌
US Patent 6958285 Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings

Patent 6958285 was granted and assigned to Tru-Si Technologies on October, 2005 by the United States Patent and Trademark Office.

Tru-Si Technologies
Tru-Si Technologies
United States Patent and Trademark Office
United States Patent and Trademark Office
6958285
October 25, 2005
22 results
0 selected
22 results
0 selected
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us