List of Powertech Technology patents

Patents where

Current Assignee

Name

‌

Powertech Technology

Name	Description	Patent Applicant	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 11367678 Package structure and manufacturing method thereof	Patent 11367678 was granted and assigned to Powertech Technology on June, 2022 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11367678	June 21, 2022
‌ US Patent 11532575 Integrated antenna package structure and manufacturing method thereof	Patent 11532575 was granted and assigned to Powertech Technology on December, 2022 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11532575	December 20, 2022
‌ US Patent 11309296 Semiconductor package and manufacturing method thereof		‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11309296	April 19, 2022
‌ US Patent 11289401 Semiconductor package	Patent 11289401 was granted and assigned to Powertech Technology on March, 2022 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11289401	March 29, 2022
‌ US Patent 11488946 Package method of a modular stacked semiconductor package	Patent 11488946 was granted and assigned to Powertech Technology on November, 2022 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11488946	November 1, 2022
‌ US Patent 11569210 Package structure having a first connection circuit and manufacturing method thereof	Patent 11569210 was granted and assigned to Powertech Technology on January, 2023 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11569210	January 31, 2023
‌ US Patent 7408245 IC package encapsulating a chip under asymmetric single-side leads	Patent 7408245 was granted and assigned to Powertech Technology on August, 2008 by the United States Patent and Trademark Office.		‌ Powertech Technology	United States Patent and Trademark Office	7408245	August 5, 2008
‌ US Patent 7902666 Flip chip device having soldered metal posts by surface mounting	Patent 7902666 was granted and assigned to Powertech Technology on March, 2011 by the United States Patent and Trademark Office.		‌ Powertech Technology	United States Patent and Trademark Office	7902666	March 8, 2011
‌ US Patent 10157828 Chip package structure with conductive pillar and a manufacturing method thereof	Patent 10157828 was granted and assigned to Powertech Technology on December, 2018 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	10157828	December 18, 2018
‌ US Patent 11545424 Package structure and manufacturing method thereof	Patent 11545424 was granted and assigned to Powertech Technology on January, 2023 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11545424	January 3, 2023
‌ US Patent 7569935 Pillar-to-pillar flip-chip assembly	Patent 7569935 was granted and assigned to Powertech Technology on August, 2009 by the United States Patent and Trademark Office.		‌ Powertech Technology	United States Patent and Trademark Office	7569935	August 4, 2009
‌ US Patent 7605018 Method for forming a die-attach layer during semiconductor packaging processes	Patent 7605018 was granted and assigned to Powertech Technology on October, 2009 by the United States Patent and Trademark Office.		‌ Powertech Technology	United States Patent and Trademark Office	7605018	October 20, 2009
‌ US Patent 11296041 Integrated antenna package structure and manufacturing method thereof	Patent 11296041 was granted and assigned to Powertech Technology on April, 2022 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11296041	April 5, 2022
‌ US Patent 7622794 COL (Chip-On-Lead) multi-chip package	Patent 7622794 was granted and assigned to Powertech Technology on November, 2009 by the United States Patent and Trademark Office.		‌ Powertech Technology	United States Patent and Trademark Office	7622794	November 24, 2009
‌ US Patent 9419033 Chip scale package of image sensor having dam combination	Patent 9419033 was granted and assigned to Powertech Technology on August, 2016 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	9419033	August 16, 2016
‌ US Patent 8048721 Method for filling multi-layer chip-stacked gaps	Patent 8048721 was granted and assigned to Powertech Technology on November, 2011 by the United States Patent and Trademark Office.		‌ Powertech Technology	United States Patent and Trademark Office	8048721	November 1, 2011
‌ US Patent 10177058 Encapsulating composition, semiconductor package and manufacturing method thereof	Patent 10177058 was granted and assigned to Powertech Technology on January, 2019 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	10177058	January 8, 2019
‌ US Patent 9716080 Thin fan-out multi-chip stacked package structure and manufacturing method thereof	Patent 9716080 was granted and assigned to Powertech Technology on July, 2017 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	9716080	July 25, 2017
‌ US Patent 7776649 Method for fabricating wafer level chip scale packages	Patent 7776649 was granted and assigned to Powertech Technology on August, 2010 by the United States Patent and Trademark Office.		‌ Powertech Technology	United States Patent and Trademark Office	7776649	August 17, 2010
‌ US Patent 9842811 Heat-dissipating semiconductor package for lessening package warpage	Patent 9842811 was granted and assigned to Powertech Technology on December, 2017 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	9842811	December 12, 2017
‌ US Patent 11557533 Package structure and manufacturing method thereof	Patent 11557533 was granted and assigned to Powertech Technology on January, 2023 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11557533	January 17, 2023
‌ US Patent 10515936 Package structure and manufacturing method thereof	Patent 10515936 was granted and assigned to Powertech Technology on December, 2019 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	10515936	December 24, 2019
‌ US Patent 10431549 Semiconductor package and manufacturing method thereof	Patent 10431549 was granted and assigned to Powertech Technology on October, 2019 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	10431549	October 1, 2019
‌ US Patent 11437336 Semiconductor package structure with landing pads and manufacturing method thereof		‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11437336	September 6, 2022
‌ US Patent 11545423 Package structure and manufacturing method thereof	Patent 11545423 was granted and assigned to Powertech Technology on January, 2023 by the United States Patent and Trademark Office.	‌ Powertech Technology	‌ Powertech Technology	United States Patent and Trademark Office	11545423	January 3, 2023

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