List of Ziptronix patents

Patents where

Current Assignee

Name

‌

Ziptronix

Name	Description	Patent Applicant	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 7485968 3D IC method and device	Patent 7485968 was granted and assigned to Ziptronix on February, 2009 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7485968	February 3, 2009
‌ US Patent 9171756 3D IC method and device	Patent 9171756 was granted and assigned to Ziptronix on October, 2015 by the United States Patent and Trademark Office.	‌ Ziptronix	‌ Ziptronix	United States Patent and Trademark Office	9171756	October 27, 2015
‌ US Patent 7109092 Method of room temperature covalent bonding	Patent 7109092 was granted and assigned to Ziptronix on September, 2006 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7109092	September 19, 2006
‌ US Patent 9385024 Room temperature metal direct bonding	Patent 9385024 was granted and assigned to Ziptronix on July, 2016 by the United States Patent and Trademark Office.	‌ Ziptronix, Inc.	‌ Ziptronix	United States Patent and Trademark Office	9385024	July 5, 2016
‌ US Patent 9331149 Method for low temperature bonding and bonded structure	Patent 9331149 was granted and assigned to Ziptronix on May, 2016 by the United States Patent and Trademark Office.	‌ Ziptronix, Inc.	‌ Ziptronix	United States Patent and Trademark Office	9331149	May 3, 2016
‌ US Patent 9184125 Heterogeneous annealing method and device	Patent 9184125 was granted and assigned to Ziptronix on November, 2015 by the United States Patent and Trademark Office.	‌ Ziptronix	‌ Ziptronix	United States Patent and Trademark Office	9184125	November 10, 2015
‌ US Patent 7126212 Three dimensional device integration method and integrated device	Patent 7126212 was granted and assigned to Ziptronix on October, 2006 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7126212	October 24, 2006
‌ US Patent 9431368 Three dimensional device integration method and integrated device	Patent 9431368 was granted and assigned to Ziptronix on August, 2016 by the United States Patent and Trademark Office.	‌ Ziptronix	‌ Ziptronix	United States Patent and Trademark Office	9431368	August 30, 2016
‌ US Patent 9716033 3D IC method and device	Patent 9716033 was granted and assigned to Ziptronix on July, 2017 by the United States Patent and Trademark Office.	‌ Ziptronix, Inc.	‌ Ziptronix	United States Patent and Trademark Office	9716033	July 25, 2017
‌ US Patent 8709938 3D IC method and device	Patent 8709938 was granted and assigned to Ziptronix on April, 2014 by the United States Patent and Trademark Office.	‌ Ziptronix	‌ Ziptronix	United States Patent and Trademark Office	8709938	April 29, 2014
‌ US Patent 6962835 Method for room temperature metal direct bonding	Patent 6962835 was granted and assigned to Ziptronix on November, 2005 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	6962835	November 8, 2005
‌ US Patent 9564414 Three dimensional device integration method and integrated device	Patent 9564414 was granted and assigned to Ziptronix on February, 2017 by the United States Patent and Trademark Office.	‌ Ziptronix, Inc.	‌ Ziptronix	United States Patent and Trademark Office	9564414	February 7, 2017
‌ US Patent 7622324 Wafer bonding hermetic encapsulation	Patent 7622324 was granted and assigned to Ziptronix on November, 2009 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7622324	November 24, 2009
‌ US Patent 8524533 Room temperature metal direct bonding	Patent 8524533 was granted and assigned to Ziptronix on September, 2013 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	8524533	September 3, 2013
‌ US Patent 8841002 Method of room temperature covalent bonding	Patent 8841002 was granted and assigned to Ziptronix on September, 2014 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	8841002	September 23, 2014
‌ US Patent 9391143 Method for low temperature bonding and bonded structure	Patent 9391143 was granted and assigned to Ziptronix on July, 2016 by the United States Patent and Trademark Office.	‌ Ziptronix	‌ Ziptronix	United States Patent and Trademark Office	9391143	July 12, 2016
‌ US Patent 7387944 Method for low temperature bonding and bonded structure	Patent 7387944 was granted and assigned to Ziptronix on June, 2008 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7387944	June 17, 2008
‌ US Patent 7335572 Method for low temperature bonding and bonded structure	Patent 7335572 was granted and assigned to Ziptronix on February, 2008 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7335572	February 26, 2008
‌ US Patent 7553744 Method for low temperature bonding and bonded structure	Patent 7553744 was granted and assigned to Ziptronix on June, 2009 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7553744	June 30, 2009
‌ US Patent 7807549 Method for low temperature bonding and bonded structure	Patent 7807549 was granted and assigned to Ziptronix on October, 2010 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7807549	October 5, 2010
‌ US Patent 6867073 Single mask via method and device	Patent 6867073 was granted and assigned to Ziptronix on March, 2005 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	6867073	March 15, 2005
‌ US Patent 9082627 Method for low temperature bonding and bonded structure	Patent 9082627 was granted and assigned to Ziptronix on July, 2015 by the United States Patent and Trademark Office.	‌ Ziptronix	‌ Ziptronix	United States Patent and Trademark Office	9082627	July 14, 2015
‌ US Patent 7335996 Method of room temperature covalent bonding	Patent 7335996 was granted and assigned to Ziptronix on February, 2008 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	7335996	February 26, 2008
‌ US Patent 8163373 Method of room temperature covalent bonding	Patent 8163373 was granted and assigned to Ziptronix on April, 2012 by the United States Patent and Trademark Office.		‌ Ziptronix	United States Patent and Trademark Office	8163373	April 24, 2012
‌ US Patent 9698126 Heterogeneous annealing method and device	Patent 9698126 was granted and assigned to Ziptronix on July, 2017 by the United States Patent and Trademark Office.	‌ Ziptronix	‌ Ziptronix	United States Patent and Trademark Office	9698126	July 4, 2017

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