List of Semigear, Inc. patents

List of Semigear, Inc. patents

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Patents where

Current Assignee

Name

is

Semigear, Inc.

	Name	Description	Patent Applicant	Current Assignee	Inventor	Patent Jurisdiction	Patent Number	Date of Patent
	‌ US Patent 7632750 Arrangement for solder bump formation on wafers	Patent 7632750 was granted and assigned to Semigear, Inc. on December, 2009 by the United States Patent and Trademark Office.		Semigear, Inc.		United States Patent and Trademark Office	7632750	December 15, 2009
	‌ US Patent 11315807 Substrate pressing module, substrate pressing method, substrate treating apparatus including the substrate treating module, and the substrate treating method		Semigear, Inc.	Semigear, Inc.		United States Patent and Trademark Office	11315807	April 26, 2022
	‌ US Patent 9741683 Device packaging facility and method, and device processing apparatus utilizing phthalate	Patent 9741683 was granted and assigned to Semigear, Inc. on August, 2017 by the United States Patent and Trademark Office.	Semigear, Inc.	Semigear, Inc.		United States Patent and Trademark Office	9741683	August 22, 2017
	‌ US Patent 9824998 Device packaging facility and method, and device processing apparatus utilizing DEHT	Patent 9824998 was granted and assigned to Semigear, Inc. on November, 2017 by the United States Patent and Trademark Office.	Semigear, Inc.	Semigear, Inc.		United States Patent and Trademark Office	9824998	November 21, 2017
	‌ US Patent 10861735 Substrate support unit	Patent 10861735 was granted and assigned to Semigear, Inc. on December, 2020 by the United States Patent and Trademark Office.	Semigear, Inc.	Semigear, Inc.		United States Patent and Trademark Office	10861735	December 8, 2020
	‌ US Patent 9629258 Reflow treating unit and substrate treating apparatus	Patent 9629258 was granted and assigned to Semigear, Inc. on April, 2017 by the United States Patent and Trademark Office.		Semigear, Inc.		United States Patent and Trademark Office	9629258	April 18, 2017
	‌ US Patent 9472531 Device packaging facility and method, and device processing apparatus utilizing phthalate	Patent 9472531 was granted and assigned to Semigear, Inc. on October, 2016 by the United States Patent and Trademark Office.	Semigear, Inc.	Semigear, Inc.		United States Patent and Trademark Office	9472531	October 18, 2016
	‌ US Patent 9226407 Reflow treating unit and substrate treating apparatus	Patent 9226407 was granted and assigned to Semigear, Inc. on December, 2015 by the United States Patent and Trademark Office.	Semigear, Inc.	Semigear, Inc.		United States Patent and Trademark Office	9226407	December 29, 2015
	‌ US Patent 9572266 Reflow treating unit and substrate treating apparatus	Patent 9572266 was granted and assigned to Semigear, Inc. on February, 2017 by the United States Patent and Trademark Office.		Semigear, Inc.		United States Patent and Trademark Office	9572266	February 14, 2017
	‌ US Patent 10937757 Device packaging facility and method, and device processing apparatus utilizing DEHT	Patent 10937757 was granted and assigned to Semigear, Inc. on March, 2021 by the United States Patent and Trademark Office.	Semigear, Inc.	Semigear, Inc.		United States Patent and Trademark Office	10937757	March 2, 2021
	‌ US Patent 10283481 Device packaging facility and method, and device processing apparatus utilizing DEHT	Patent 10283481 was granted and assigned to Semigear, Inc. on May, 2019 by the United States Patent and Trademark Office.		Semigear, Inc.		United States Patent and Trademark Office	10283481	May 7, 2019
	‌ US Patent 10790179 Alignment apparatus		Semigear, Inc.	Semigear, Inc.		United States Patent and Trademark Office	10790179	September 29, 2020
	‌ US Patent 8252678 Flux-free chip to wafer joint serial thermal processor arrangement	Patent 8252678 was granted and assigned to Semigear, Inc. on August, 2012 by the United States Patent and Trademark Office.		Semigear, Inc.		United States Patent and Trademark Office	8252678	August 28, 2012
	‌ US Patent 8274161 Flux-free chip to substrate joint serial linear thermal processor arrangement	Patent 8274161 was granted and assigned to Semigear, Inc. on September, 2012 by the United States Patent and Trademark Office.		Semigear, Inc.		United States Patent and Trademark Office	8274161	September 25, 2012
	‌ US Patent 8524593 Arrangement for solder bump formation on wafers			Semigear, Inc.		United States Patent and Trademark Office	8524593	September 3, 2013
	‌ US Patent 7008879 Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry	Patent 7008879 was granted and assigned to Semigear, Inc. on March, 2006 by the United States Patent and Trademark Office.		Semigear, Inc.		United States Patent and Trademark Office	7008879	March 7, 2006

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