Golden has been acquired by ComplyAdvantage.Read about it here ⟶

List of Global Circuit Innovations, Inc. patents

List of Global Circuit Innovations, Inc. patents

List of POSTECH patents

List of JANSEN'S AIRCRAFT SYSTEMS CONTROLS, INC. patents

List of Lite-On patents

List of patents in the Decentralized autonomous organization (DAO) industry

List of SBIR/STTR awards granted to Base Pair Biotechnologies

Patents where

Current Assignee

Name

is

Global Circuit Innovations, Inc.

	Name	Description	Patent Applicant	Current Assignee	Inventor	Patent Jurisdiction	Patent Number	Date of Patent
	‌ US Patent 11618951 Chemical evaporation control system	Patent 11618951 was granted and assigned to Global Circuit Innovations, Inc. on April, 2023 by the United States Patent and Trademark Office.	Global Circuit Innovations, Inc.	Global Circuit Innovations, Inc.		United States Patent and Trademark Office	11618951	April 4, 2023
	‌ US Patent 9870968 Repackaged integrated circuit and assembly method	Patent 9870968 was granted and assigned to Global Circuit Innovations, Inc. on January, 2018 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	9870968	January 16, 2018
	‌ US Patent 11508680 Solder ball application for singular die	Patent 11508680 was granted and assigned to Global Circuit Innovations, Inc. on November, 2022 by the United States Patent and Trademark Office.	Global Circuit Innovations, Inc.	Global Circuit Innovations, Inc.		United States Patent and Trademark Office	11508680	November 22, 2022
	‌ US Patent 10460326 Counterfeit integrated circuit detection by comparing integrated circuit signature to reference signature	Patent 10460326 was granted and assigned to Global Circuit Innovations, Inc. on October, 2019 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10460326	October 29, 2019
	‌ US Patent 9935028 Method and apparatus for printing integrated circuit bond connections	Patent 9935028 was granted and assigned to Global Circuit Innovations, Inc. on April, 2018 by the United States Patent and Trademark Office.	Global Circuit Innovations, Inc.	Global Circuit Innovations, Inc.		United States Patent and Trademark Office	9935028	April 3, 2018
	‌ US Patent 9711480 Environmental hardened packaged integrated circuit	Patent 9711480 was granted and assigned to Global Circuit Innovations, Inc. on July, 2017 by the United States Patent and Trademark Office.	Global Circuit Innovations, Inc.	Global Circuit Innovations, Inc.		United States Patent and Trademark Office	9711480	July 18, 2017
	‌ US Patent 11257726 Low profile integrated circuit	Patent 11257726 was granted and assigned to Global Circuit Innovations, Inc. on February, 2022 by the United States Patent and Trademark Office.	Global Circuit Innovations, Inc.	Global Circuit Innovations, Inc.		United States Patent and Trademark Office	11257726	February 22, 2022
	‌ US Patent 9824948 Integrated circuit with printed bond connections	Patent 9824948 was granted and assigned to Global Circuit Innovations, Inc. on November, 2017 by the United States Patent and Trademark Office.	Global Circuit Innovations, Inc.	Global Circuit Innovations, Inc.		United States Patent and Trademark Office	9824948	November 21, 2017
	‌ US Patent 10177056 Repackaged integrated circuit assembly method	Patent 10177056 was granted and assigned to Global Circuit Innovations, Inc. on January, 2019 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10177056	January 8, 2019
	‌ US Patent 9966319 Environmental hardening integrated circuit method and apparatus	Patent 9966319 was granted and assigned to Global Circuit Innovations, Inc. on May, 2018 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	9966319	May 8, 2018
	‌ US Patent 11077654 Conductive diamond application system	Patent 11077654 was granted and assigned to Global Circuit Innovations, Inc. on August, 2021 by the United States Patent and Trademark Office.	Global Circuit Innovations, Inc.	Global Circuit Innovations, Inc.		United States Patent and Trademark Office	11077654	August 3, 2021
	‌ US Patent 10654259 Conductive diamond application method	Patent 10654259 was granted and assigned to Global Circuit Innovations, Inc. on May, 2020 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10654259	May 19, 2020
	‌ US Patent 10115645 Repackaged reconditioned die method and assembly	Patent 10115645 was granted and assigned to Global Circuit Innovations, Inc. on October, 2018 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10115645	October 30, 2018
	‌ US Patent 10109606 Remapped packaged extracted die	Patent 10109606 was granted and assigned to Global Circuit Innovations, Inc. on October, 2018 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10109606	October 23, 2018
	‌ US Patent 10128161 3D printed hermetic package assembly and method	Patent 10128161 was granted and assigned to Global Circuit Innovations, Inc. on November, 2018 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10128161	November 13, 2018
	‌ US Patent 10177054 Method for remapping a packaged extracted die	Patent 10177054 was granted and assigned to Global Circuit Innovations, Inc. on January, 2019 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10177054	January 8, 2019
	‌ US Patent 10431510 Hermetic lid seal printing method	Patent 10431510 was granted and assigned to Global Circuit Innovations, Inc. on October, 2019 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10431510	October 1, 2019
	‌ US Patent 10002846 Method for remapping a packaged extracted die with 3D printed bond connections	Patent 10002846 was granted and assigned to Global Circuit Innovations, Inc. on June, 2018 by the United States Patent and Trademark Office.		Global Circuit Innovations, Inc.		United States Patent and Trademark Office	10002846	June 19, 2018
	‌ US Patent 11978711 Solder ball application for singular die	Patent 11978711 was granted and assigned to Global Circuit Innovations, Inc. on May, 2024 by the United States Patent and Trademark Office.	Global Circuit Innovations, Inc.	Global Circuit Innovations, Inc.		United States Patent and Trademark Office	11978711	May 7, 2024

19 results

0 selected

19 results

0 selected