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US Patent 7221731 X-ray microscopic inspection apparatus

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
72217310
Patent Inventor Names
Hiromi Kai0
Keiji Yada0
Yasushi Saito0
Date of Patent
May 22, 2007
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Patent Application Number
107198870
Date Filed
November 21, 2003
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Patent Citations Received
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US Patent 11992350 System and method for compact laminography utilizing microfocus transmission x-ray source and variable magnification x-ray detector
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US Patent 11885755 X-ray sequential array wavelength dispersive spectrometer
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US Patent 11921059 Inspection apparatus and inspection method
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US Patent 11927554 Inspection apparatus and inspection method
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US Patent 11940394 Inspection apparatus and inspection method
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US Patent 11971370 Inspection apparatus and inspection method
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US Patent 11977038 Inspection apparatus and inspection method
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US Patent 11686692 High throughput 3D x-ray imaging system using a transmission x-ray source
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Patent Primary Examiner
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Edward J. Glick
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Patent abstract

To provide an X-ray microscopic inspection apparatus capable of performing non-destructive inspection with high resolving power within a very short period, and having advantageous functions such as a high precision electron probe control function, a CT function, an elemental analysis function, and a target switching function. The apparatus includes a magnetic superposition lens having a magnetic field generating portion disposed in the vicinity of an electron generating portion of an electron gun; reflected electron detecting means having a detecting portion disposed above the target for X-ray generation, for detecting a reflected electron from the target; and electron image generating means for performing imaging of a target surface utilizing the signals from the reflected electron detecting means, wherein the apparatus is arranged so that alignment including focus adjustment to the target for X-ray generation and astigmatism correction may be performed based on image information of the electron image. Further, the apparatus is equipped with functions such as the electron probe control function, the CT function, the electron axis alignment function the elemental analysis function, and the target switching function.

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