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US Patent 12137516 Package with self shielding

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
October 6, 2022
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Date of Patent
November 5, 2024
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Patent Application Number
17961235
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Patent Citations
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US Patent 8686543 3D chip package with shielded structures
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US Patent 8890628 Ultra slim RF package for ultrabooks and smart phones
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US Patent 9401347 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
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US Patent 10827617 Printed circuit board with cavity
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US Patent 10319685 EMI shielded integrated circuit packages and methods of making the same
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US Patent 11355829 Vertical switched filter bank
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US Patent 7245884 RF module
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US Patent 8432022 Shielded embedded electronic component substrate fabrication method and structure
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Patent Inventor Names
Martin Handtmann
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Li Sun
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Lueder Elbrecht
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Hongya Xu
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Valter Pasku
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12137516
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Patent Primary Examiner
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Sherman Ng
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CPC Code
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H05K 1/185
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H05K 1/183
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H05K 2201/09618
0
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H05K 1/0222
0
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H05K 1/0219
0
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H05K 3/4697
0

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