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US Patent 12137516 Package with self shielding

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
121375160
Patent Inventor Names
Martin Handtmann0
Li Sun0
Lueder Elbrecht0
Hongya Xu0
Valter Pasku0
Date of Patent
November 5, 2024
0
Patent Application Number
179612350
Date Filed
October 6, 2022
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Patent Citations
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US Patent 8686543 3D chip package with shielded structures
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US Patent 8890628 Ultra slim RF package for ultrabooks and smart phones
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US Patent 9401347 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
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US Patent 10827617 Printed circuit board with cavity
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US Patent 10319685 EMI shielded integrated circuit packages and methods of making the same
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US Patent 11355829 Vertical switched filter bank
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US Patent 7245884 RF module
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US Patent 8432022 Shielded embedded electronic component substrate fabrication method and structure
0
Patent Primary Examiner
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Sherman Ng
0
CPC Code
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H05K 1/185
0
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H05K 1/183
0
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H05K 2201/09618
0
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H05K 1/0222
0
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H05K 1/0219
0
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H05K 3/4697
0
Patent abstract

One way to stop electromagnetic fields from leaking outside of a module is an electric wall. Embodiments of the present disclosure are directed to emulating an electric wall with through vias. The through vias may be arranged around cavities in the printed circuit board. The density of the through vias may be selected based on an expected wavelength of the electromagnetic fields. The printed circuit board may then self-isolate components within the cavities from the electromagnetic fields.

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