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US Patent 11505718 Barrier ruthenium chemical mechanical polishing slurry

Patent 11505718 was granted and assigned to FUJIFILM Electronic Materials U.S.A., Inc. on November, 2022 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Patent attributes

Current Assignee

FUJIFILM Electronic Materials U.S.A., Inc.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

11505718

Date of Patent

November 22, 2022

Patent Application Number

17318011

Date Filed

May 12, 2021

Patent Citations

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US Patent 10253216 Additives for barrier chemical mechanical planarization

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US Patent 10647900 Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors

Patent Primary Examiner

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Jiong-Ping Lu

A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further include abrasive, acid(s), and, optionally, an alkoxylated alcohol. With these components, the slurry exhibits a high ruthenium to copper removal rate ratio.