List of Amkor Technology patents

Patents where

Current Assignee

Name

Amkor Technology

Name	Description	Patent Applicant	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 9613829 Method for fabricating semiconductor package and semiconductor package using the same	Patent 9613829 was granted and assigned to Amkor Technology on April, 2017 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	9613829	April 4, 2017
‌ US Patent 10074630 Semiconductor package with high routing density patch	Patent 10074630 was granted and assigned to Amkor Technology on September, 2018 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10074630	September 11, 2018
‌ US Patent 9484291 Robust pillar structure for semicondcutor device contacts	Patent 9484291 was granted and assigned to Amkor Technology on November, 2016 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	9484291	November 1, 2016
‌ US Patent 10199312 Method of forming a packaged semiconductor device having enhanced wettable flank and structure	Patent 10199312 was granted and assigned to Amkor Technology on February, 2019 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10199312	February 5, 2019
‌ US Patent 10410999 Semiconductor device with integrated heat distribution and manufacturing method thereof	Patent 10410999 was granted and assigned to Amkor Technology on September, 2019 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10410999	September 10, 2019
‌ US Patent 10121742 Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure	Patent 10121742 was granted and assigned to Amkor Technology on November, 2018 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10121742	November 6, 2018
‌ US Patent 10032705 Semiconductor package and manufacturing method thereof	Patent 10032705 was granted and assigned to Amkor Technology on July, 2018 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10032705	July 24, 2018
‌ US Patent 9780074 Semiconductor package using a coreless signal distribution structure	Patent 9780074 was granted and assigned to Amkor Technology on October, 2017 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	9780074	October 3, 2017
‌ US Patent 10283400 Semiconductor device package and manufacturing method thereof	Patent 10283400 was granted and assigned to Amkor Technology on May, 2019 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10283400	May 7, 2019
‌ US Patent 9607919 Semiconductor device with thin redistribution layers	Patent 9607919 was granted and assigned to Amkor Technology on March, 2017 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	9607919	March 28, 2017
‌ US Patent 9818708 Semiconductor device with thin redistribution layers	Patent 9818708 was granted and assigned to Amkor Technology on November, 2017 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	9818708	November 14, 2017
‌ US Patent 9966300 Semiconductor device package and manufacturing method thereof	Patent 9966300 was granted and assigned to Amkor Technology on May, 2018 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	9966300	May 8, 2018
‌ US Patent 10177117 Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure	Patent 10177117 was granted and assigned to Amkor Technology on January, 2019 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10177117	January 8, 2019
‌ US Patent 9875980 Copper pillar sidewall protection	Patent 9875980 was granted and assigned to Amkor Technology on January, 2018 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	9875980	January 23, 2018
‌ US Patent 9576917 Embedded die in panel method and structure	Patent 9576917 was granted and assigned to Amkor Technology on February, 2017 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	9576917	February 21, 2017
‌ US Patent 9704725 Semiconductor device with leadframe configured to facilitate reduced burr formation	Patent 9704725 was granted and assigned to Amkor Technology on July, 2017 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	9704725	July 11, 2017
‌ US Patent 10090234 Semiconductor device package and manufacturing method thereof	Patent 10090234 was granted and assigned to Amkor Technology on October, 2018 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10090234	October 2, 2018
‌ US Patent 9337137 Method and system for solder shielding of ball grid arrays	Patent 9337137 was granted and assigned to Amkor Technology on May, 2016 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	9337137	May 10, 2016
‌ US Patent 10340244 Semiconductor device and manufacturing method thereof	Patent 10340244 was granted and assigned to Amkor Technology on July, 2019 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10340244	July 2, 2019
‌ US Patent 10134687 Semiconductor device and method of manufacturing a semiconductor device	Patent 10134687 was granted and assigned to Amkor Technology on November, 2018 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	10134687	November 20, 2018
‌ US Patent 9048125 Semiconductor device and manufacturing method thereof	Patent 9048125 was granted and assigned to Amkor Technology on June, 2015 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	9048125	June 2, 2015
‌ US Patent 9716071 Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening	Patent 9716071 was granted and assigned to Amkor Technology on July, 2017 by the United States Patent and Trademark Office.	Amkor Technology	Amkor Technology	United States Patent and Trademark Office	9716071	July 25, 2017
‌ US Patent 9420378 Top port MEMS microphone package and method	Patent 9420378 was granted and assigned to Amkor Technology on August, 2016 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	9420378	August 16, 2016
‌ US Patent 10257942 Stackable variable height via package and method	Patent 10257942 was granted and assigned to Amkor Technology on April, 2019 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	10257942	April 9, 2019
‌ US Patent 9892990 Semiconductor package lid thermal interface material standoffs	Patent 9892990 was granted and assigned to Amkor Technology on February, 2018 by the United States Patent and Trademark Office.		Amkor Technology	United States Patent and Trademark Office	9892990	February 13, 2018

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