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US Patent RE46315 Large diameter, high quality SiC single crystals, method and apparatus

Patent RE46315 was granted and assigned to II-VI Incorporated on February, 2017 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Patent Applicant
II-VI Incorporated
II-VI Incorporated
Current Assignee
II-VI Incorporated
II-VI Incorporated
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
RE46315
Patent Inventor Names
Andrew E. Souzis0
Thomas E. Anderson0
Varatharajan Rengarajan0
Xueping Xu0
Avinash K. Gupta0
Gary E. Ruland0
Ilya Zwieback0
Ping Wu0
Date of Patent
February 21, 2017
Patent Application Number
14506963
Date Filed
October 6, 2014
Patent Citations Received
‌
US Patent 11859965 Material analysis method
0
Patent Primary Examiner
‌
Alan Diamond
Patent abstract

A method and system of forming large-diameter SiC single crystals suitable for fabricating high crystal quality SiC substrates of 100, 125, 150 and 200 mm in diameter are described. The SiC single crystals are grown by a seeded sublimation technique in the presence of a shallow radial temperature gradient. During SiC sublimation growth, a flux of SiC bearing vapors filtered from carbon particulates is substantially restricted to a central area of the surface of the seed crystal by a separation plate disposed between the seed crystal and a source of the SiC bearing vapors. The separation plate includes a first, substantially vapor-permeable part surrounded by a second, substantially non vapor-permeable part. The grown crystals have a flat or slightly convex growth interface. Large-diameter SiC wafers fabricated from the grown crystals exhibit low lattice curvature and low densities of crystal defects, such as stacking faults, inclusions, micropipes and dislocations.

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