US Patent 9636784 Mixed alloy solder paste
Patent 9636784 was granted and assigned to Indium Corporation on May, 2017 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 10, 2015
0
Date of Patent
May 2, 2017
0
Patent Applicant
Patent Application Number
14643868
0
Patent Inventor Names
Ning-Cheng Lee
0
Hongwen Zhang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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