Patent attributes
A method of forming a plantable structure involves providing a substrate element, a release layer spaced from the substrate element, an adhesive layer disposed between the substrate element and the release layer, and at least one seed abutting the adhesive layer. The seed(s) is/are coupled to the substrate element through the adhesive layer. The method further comprises removing the release layer from the composite article, and adhering a remaining portion of the composite article to a secondary article. The remaining portion of the secondary article comprises the substrate element, the adhesive layer disposed on the substrate element, and the seed(s) abutting the adhesive layer. Also disclosed herein are a method of planting at least one seed with a composite article, a packaging structure, a method of forming a packaging structure, and a method of planting at least one seed.
