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US Patent 9155224 Thermally controlled assembly

Patent 9155224 was granted and assigned to Napatech on October, 2015 by the United States Patent and Trademark Office.

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Current Assignee
Napatech
Napatech
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
91552240
Date of Patent
October 6, 2015
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Patent Application Number
136425790
Date Filed
April 19, 2011
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Patent Primary Examiner
‌
Anthony Haughton
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Patent abstract

A printed circuit board having an electronic component which is to be cooled by a cooling surface biased thereon, where the biasing elements are abutted not by the PCB but a stiffer element attached to the PCB in order to not strain or bend the PCB.

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