Log in
Enquire now
‌

US Patent 8978883 Electronic device case with a co-molded stand

Patent 8978883 was granted and assigned to Fellowes on March, 2015 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Fellowes
Fellowes
Current Assignee
Fellowes
Fellowes
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8978883
Date of Patent
March 17, 2015
Patent Application Number
14174792
Date Filed
February 6, 2014
Patent Citations Received
‌
US Patent D1020726 Case for mobile telephone
0
Patent Primary Examiner
‌
Jacob K. Ackun Jr.
Patent abstract

A case for use with a portable electronic device includes a first material configured to surround a back portion and side portions of the portable electronic device, the first material generally being positioned at an exterior of the case. The case also includes a second material secured to the first material, the second material having greater flexibility than the first material. The case additionally includes a movable stand configured to selectively extend from the first material to support the case in an elevated position. The movable stand is coupled to the first material by the second material.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 8978883 Electronic device case with a co-molded stand

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.