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US Patent 8747625 Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers

Patent 8747625 was granted and assigned to Nanjing University of Aeronautics and Astronautics on June, 2014 by the United States Patent and Trademark Office.

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Patent

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Current Assignee

Nanjing University of Aeronautics and Astronautics

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

87476250

Patent Inventor Names

Wei Wang0

Zhengxun Liu0

Date of Patent

June 10, 2014

Patent Application Number

136398470

Date Filed

July 14, 2010

Patent Primary Examiner

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Sun James Lin

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