Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Randall C. Veitch0
Thomas W. Stone0
Date of Patent
May 8, 2012
Patent Application Number
12477046
Date Filed
June 2, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.
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