US Patent 7755372 Method for automated stress testing of flip-chip packages

Methods for testing flip-chip packages includes aligning a microscope and a test engine. The package under test is placed between the microscope and the test engine, and an acoustic transducer is attached to the package under test. The test engine delivers an impact to the package under test on the side of the package opposite its ball-grid array. Acoustic information and image information from the package under test is recorded. In alternate embodiments, a sequence of packages may be automatically tested.