Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 6, 2008
Patent Application Number
10861714
Date Filed
June 4, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
An apparatus for an improved Ball Grid Array (BGA) package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a BGA package structured to house the semiconductor device and the antenna pad. The antenna pad may be coupled to the radio frequency (RF) input or output, and the antenna pad is structured to reduce the inductance of the BGA package. The antenna pad may include a pad disposed above the semiconductor device, a pad disposed to the side of the semiconductor device, or an antenna chip. An antenna may be coupled to the antenna pad. The antenna may include a trace antenna, a staggered antenna, or a helical antenna.
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