Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zengyan Fan0
Date of Patent
May 7, 2024
0Patent Application Number
176471670
Date Filed
January 5, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
A method for forming the packaging structure includes: providing a substrate; forming a plurality of mutually independent conductive wires on the substrate, wherein a trench is provided between adjacent conductive wires; oxidizing side walls of each of the conductive wires to form a barrier layer; and forming a solder mask at least filling the trench.
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